Apollo Seiko DCN-08D-2 Nitrogen Soldering Tip DCN series tips Apollo Solder tips

Price:	30.0 USD
Payment Terms:	T/T,WU,Paypal
Place of Origin:	Guangdong, China (Mainland)


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Product Detail

Means of Transport: Air

Packing: 10pcs per box

Brand Name: Apollo

Production Capacity: 1500pcs per month

Delivery Date: 3 days

Type: Export

Leisto manufacturers soldering iron tips and distributes automatic tape dispensers, automatic screw feeder and automatic label dispensers.

Apollo solder tips DCN series:
Leisto's production Apollo Seiko compatible soldering tips have good performance such as low temperature difference (plus-minus 10 degree),smooth solder wetting performance.The great base copper & precise plating technology improves the thermal conductivity and reduce the temperature recovery time.The soldering tip can make the robots get the most out of automated soldering:working stable,low faulty soldering joints.

Specifications of Apollo DCN-08D-2 Soldering Tip:
One side tinning
DC48V, Total Length: 101mm
Diameter: 6.4mm
Tip width: a: 3mm, b: 0.8mm
Tip thickness (c): 0.3mm
Tin area, two side (d): 0.8mm

Advantages of Leisto Soldering Tip:
- Made with pure oxygen-free copper
- Long time electroplating makes the plating layer more denser, the life time is longer than other tips
- Short lead time for standard robot tips
- The cost is much lower than original tips
- Custom made available

Tip Cleaning Notes:
If the sponge cleaner is utilized, air-blow cleaning is normally not required.
Some applications require air-blow & sponge tip cleaning (depending upon tip type)
Standard cleaning duration is 0.5 second
The iron tip does not need to be extended if not required
The air-blow cup is not included with the standard Luna system

If the tip is not wetting with solder (oxidation):
Remove pre-solder on tip completely.
Remove oxidation by sand paper after cooling down the iron tip to room temperature.
Turn on the power and apply solder on the iron tip during rising the temperature (manually).
The tip will wet with solder by the above process.